MOLYBDENUM–COPPER COMPOSITES & THERMAL MANAGEMENT

MoCu Molybdenum–Copper — Technical Sourcing

Composition-controlled sourcing for MoCu sheet, blanks, heat spreaders, contacts and components to drawing.

MNK-G.S.A sources molybdenum–copper composite material by explicit Mo/Cu ratio, production route, product form, physical-property requirements, dimensions, inspection documents and destination.

MoCu Composition Is Part of the Product Definition

MoCu is a family of composite materials rather than one universal alloy grade. Specialist manufacturers publish different molybdenum-to-copper ratios to tune thermal expansion, thermal conductivity, density, strength and processability. The required composition and properties must therefore be written into the inquiry.

Material Definition and Supply Scope

MoCu 65/35

Manufacturer reference composition: Mo 65 ± 3 % / Cu 35 ± 3 %. Percentage basis not explicitly identified in the source. The stated spread is not a universal acceptance limit. H.C. Starck PD-7101, p. 1.

MoCu 70/30

Manufacturer reference composition: Mo 70 ± 3 % / Cu 30 ± 3 %. Percentage basis not explicitly identified in the source. The stated spread is not a universal acceptance limit. H.C. Starck PD-7101, p. 1.

MoCu 80/20

Manufacturer reference composition: Mo 80 ± 3 % / Cu 20 ± 3 %. Percentage basis not explicitly identified in the source. The stated spread is not a universal acceptance limit. H.C. Starck PD-7101, p. 1.

Rolled Sheet and Blanks

Thin sheet, cut blanks and heat-spreader formats sourced by composition, thickness, flatness, width, length, surface and plating requirements.

Infiltrated Components

Copper-infiltrated porous molybdenum parts and semi-finished products sourced by drawing and defined physical-property requirements.

Cu/Mo/Cu Laminates

Copper-clad molybdenum laminates are a separate layered material family. They are not treated as equivalent to homogeneous or infiltrated MoCu composites.

Supply Forms and Size Confirmation

Dimensions are confirmed for a named composition, production route and condition. The SMI example below is a published manufacturer capability, not MNK stock or a universal MoCu envelope.

Product FormSizing basisNotes
RodAccording to specificationConfirm diameter and length together for the selected composition and route.
FoilAccording to specificationConfirm composition, condition, thickness and width together; no universal minimum is stated here.
Thin Flat ProductsAccording to specificationConfirm thickness, width, length and flatness as one combination.
Plate / BlockAccording to specificationComposition, physical-property requirements and complete dimensions govern feasibility.
Mo/Cu components: SMI exampleThickness Component thickness: 0.125–25 mm Spectra-Mat Mo/Cu components; Spectra-Mat. Manufacturer programme example only, not MNK stock or a universal MoCu envelope. Confirm composition, geometry, finish and the complete size combination together. Source: Spectra-Mat PB-600 D (D / 04-2014, p. 1). Reviewed: 2026-09-21.; maximum dimension ≤250 mmSMI PB-600 D, p.1. Manufacturer programme only; confirm grade, geometry, finish and the complete size combination.

State the required Mo/Cu composition and explicitly identify the percentage basis (mass or volume); a grade ratio alone does not establish that basis. Confirm the manufacturer grade, route and acceptance requirements rather than treating catalogue reference values as universal limits. Composition references reviewed: .

Actual availability depends on grade, specification, quantity, tolerances, certification requirements and manufacturing source. Diameter, thickness, width and length must be confirmed as one complete combination.

Standards and Documentation

Manufacturer Specifications

Record the manufacturer, grade designation and datasheet revision in the agreed specification. Similar nominal Mo/Cu ratios do not make datasheets interchangeable.

No Universal ASTM Grade

A commercial MoCu designation is not presented as an ASTM grade unless a specific applicable document is stated and its product-form scope is confirmed.

Customer Property Limits

Thermal conductivity, coefficient of thermal expansion, electrical conductivity, density, hardness and strength are specified where relevant to the application.

EN 10204:2004

Inspection-document type may be requested under the European framework. Available chemistry, physical-property and dimensional results are agreed with the selected manufacturer.

EN / DIN Requirements

No generic EN or DIN equivalent is assumed for MoCu commercial compositions. A requested European document is checked by number, edition and technical scope.

Drawing and Inspection

For finished thermal-management components, the drawing, flatness, finish, plating, dimensional report and traceability requirements govern the quotation.

Reference Physical and Mechanical Properties

Reference Basis

H.C. Starck PD-7101, revision 1, 2020-11-19, p.1. Reference values for infiltrated composites, not universal acceptance limits. Density measurement conditions are not stated in this sheet.

Density

65/35: 9.72 ± 0.04 g/cm³; 70/30: 9.78 ± 0.04 g/cm³; 80/20: 9.92 ± 0.05 g/cm³.

Thermal Expansion

Mean linear thermal expansion coefficient: 8.6 ×10⁻⁶/K MoCu 65/35; H.C. Starck Hermsdorf. Mean coefficient over 20–100 °C for this manufacturer's infiltrated composition. Do not combine values from different temperature intervals. Source: H.C. Starck PD-7101 (1 / 2020-11-19, p. 1). Reviewed: 2026-09-21.

Mean linear thermal expansion coefficient: 8.2 ×10⁻⁶/K MoCu 70/30; H.C. Starck Hermsdorf. Mean coefficient over 20–100 °C for this manufacturer's infiltrated composition. Do not combine values from different temperature intervals. Source: H.C. Starck PD-7101 (1 / 2020-11-19, p. 1). Reviewed: 2026-09-21.

Mean linear thermal expansion coefficient: 6.3 ×10⁻⁶/K MoCu 80/20; H.C. Starck Hermsdorf. Mean coefficient over 20–100 °C for this manufacturer's infiltrated composition. Do not combine values from different temperature intervals. Source: H.C. Starck PD-7101 (1 / 2020-11-19, p. 1). Reviewed: 2026-09-21.

Thermal Conductivity

65/35: ≥200 W/(m·K); 70/30: ≥190 W/(m·K); 80/20: ≥170 W/(m·K). The cited sheet does not state the measurement temperature or direction; agree these before using the values in a design.

Electrical and Mechanical

Electrical conductivity: 65/35: ≥47 % IACS; 70/30: ≥45 % IACS; 80/20: ≥35 % IACS. For mechanical acceptance, specify the hardness test and product form; do not merge bar and sheet strength data.

Certificate Control

Actual composition, density, thermal properties, electrical conductivity, hardness and strength depend on the selected grade, production route and product form and must be confirmed on the approved datasheet or certificate.

Application Context

Thermal Management

Heat spreaders, heat sinks and base plates for power electronics and semiconductor packaging where expansion matching and heat transfer must be balanced.

Electrical Components

Selected contact and electrode applications developed around composition, conductivity, erosion behavior and geometry.

Custom Packaging Parts

Plated, machined, stamped or EDM-cut components supplied to drawing after confirming material architecture and inspection.

Capability Note

Published examples apply only to the identified manufacturer programme, not guaranteed stock or every MoCu composition. Confirm the complete dimensions, condition, tolerances and quantity together.

Technical Sources and Revision

Technical review: 14 September 2026. The document editions below are retained explicitly; this review date does not make an older datasheet a new edition.

External documents are in English. Do not combine values from different manufacturers, grades, forms or temperature intervals into one acceptance specification. SMI thickness is shown in millimetres after conversion from the source units. Sources do not confirm MNK stock, supplier partnerships or conformity of a delivered lot. Confirm the applicable datasheet revision and test conditions for the order.

Send Your MoCu Molybdenum–Copper Inquiry

Provide the material grade or composition, governing specification, product form, complete dimensions, quantity, inspection-document requirements and delivery destination.

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