TUNGSTEN–COPPER COMPOSITES & ENGINEERED CONTACTS
WCu Tungsten–Copper — Technical Sourcing
Composition-controlled sourcing for tungsten–copper contacts, heat sinks, EDM electrodes, blanks and custom components.
MNK-G.S.A sources WCu by explicit tungsten/copper ratio, governing application specification, production route, physical properties, dimensions, drawing and required inspection documents.
WCu Is a Composite System, Not One Grade
Tungsten–copper materials are commonly produced by infiltrating a porous tungsten structure with copper. Changing the tungsten/copper ratio changes density, conductivity, thermal expansion, hardness and erosion behavior. A shorthand such as WCu80 must therefore be confirmed against an exact composition and manufacturer specification.
Material Definition and Supply Scope
WCu 70/30
Manufacturer-published composition with nominal 70% tungsten and 30% copper for selected electrical, thermal and machining-electrode applications.
WCu 75/25
Intermediate manufacturer-defined composition used where the required balance of conductivity, density, thermal expansion and hardness is documented.
WCu 80/20
Widely referenced composition family, but exact tolerance, density and properties must be confirmed from the selected producer’s specification.
WCu 85/15
Higher-tungsten composition with different hardness, density and conductivity from lower-tungsten WCu families.
WCu 90/10
High-tungsten manufacturer-published composition; availability, achievable geometry and property limits are checked for each inquiry.
Custom and Coated Parts
Near-net, machined, ground, plated or otherwise finished components supplied to drawing after review of material, geometry and inspection.
Typical Global Sourcing Range
The ranges below represent typical global sourcing and manufacturing capability across specialist sources. They are not MNK stock and do not describe one universal factory envelope.
| Product Form | Typical Global Sourcing Range | Notes |
|---|---|---|
| Rod | Ø2–320 mm | Typical length to approximately 300 mm. |
| Plate / Block | 2–200 mm thickness | Width and length approximately to 300 mm, subject to composition and route. |
| Near-Net Shapes | According to specification | Composition, density and physical-property requirements govern feasibility. |
| Custom Machined Parts | According to drawing | Flatness, finish, plating and inspection are confirmed before quotation. |
ASTM B702 applies only to copper-tungsten electrical contact material within its scope.
Actual availability depends on grade, specification, quantity, tolerances, certification requirements and manufacturing source. Diameter, thickness, width and length must be confirmed as one complete combination.
Standards and Documentation
ASTM B702-93(2024)
Covers copper–tungsten electrical contact components made by powder-metallurgical procedures. It does not automatically apply to every WCu heat sink, EDM electrode or custom part.
Manufacturer Compositions
Specialist datasheets publish systems such as 70/30, 75/25, 80/20, 85/15 and 90/10. Composition tolerances and properties remain manufacturer-controlled unless otherwise specified.
Application Specifications
Electrical-contact, thermal-management and electrode applications may require different acceptance tests. The end-use specification must be stated explicitly.
EN 10204:2004
European inspection-document type can be requested where the selected manufacturer can provide the agreed traceability and test results.
EN / IEC / DIN Scope
No European or international document is assumed from the shorthand WCu. Any EN, IEC or DIN requirement is checked by exact reference and application scope.
Property Verification
Composition, density, hardness, electrical or thermal conductivity and dimensional inspection are defined according to the customer’s governing requirement.
Reference Physical and Mechanical Properties
Reference Basis
Published specialist data for infiltrated WCu 70/30, 75/25, 80/20, 85/15 and 90/10 compositions show how properties change with the W/Cu ratio. Values are not universal certificate limits.
Density
Published reference density spans approximately 14.3 to 17.3 g/cm³ across the listed WCu compositions, with grade-specific tolerances.
Thermal Expansion
Published mean CTE at 20–100 °C decreases from about 8.8 × 10⁻⁶/K for WCu 70/30 to about 6.1 × 10⁻⁶/K for WCu 90/10.
Thermal Conductivity
The published composition-dependent ranges extend from approximately 130 to 240 W/(m·K). Copper content, porosity and manufacturing route influence the result.
Electrical and Mechanical
The cited data show electrical conductivity of at least about 25–30% IACS, hardness around 160–290 HB and nominal Young’s modulus around 220–340 GPa across the listed families.
Certificate Control
Composition, density, CTE, thermal and electrical conductivity, hardness and strength must be verified for the exact grade, route and finished product offered.
Application Context
Electrical Contacts
High- and medium-voltage contact components where composition, electrical behavior and erosion resistance are controlled.
EDM and Welding Electrodes
Electrodes for erosive machining or selected resistance-welding applications, subject to the exact process and geometry.
Thermal Management
Heat sinks and package components requiring a tailored combination of density, conductivity and thermal expansion.
Capability Note
Published dimensional ranges describe demonstrated manufacturing capability across specialist sources, not guaranteed stock and not one universal mill envelope. Diameter, thickness, width, length, condition, tolerance and quantity must be confirmed as one complete combination for each inquiry.
Relevant ASTM Tungsten References
Use the relevant ASTM reference together with the customer specification, drawing, required product form and inspection route. The standard number alone does not establish grade equivalence, stock availability, conformity or fitness for service.
Send Your WCu Tungsten–Copper Inquiry
Provide the material grade or composition, governing specification, product form, complete dimensions, quantity, inspection-document requirements and delivery destination.